High Power DBC Direct Bond Copper Metallization Circuit Plated Aluminum Nitrde Metallized Ceramic Substrate

Features of Ceramic Substrate：

1.Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation

Advantages of DBC ceramic substrate:
>high mechanical strength
>fine thermal conducticity
>excellent electrical isolation
>good adhesion
>corrosion resistant
>high reliability
>environmentally clean

Applications of DBC ceramic substrate:
1.power semiconductor modules
2.semiconductor refrig-erators
3.power control circuits
4.high frequency switch mode power suppliers
5.solid-state relays