DBC Direct Bond Copper Metallization Circuit Aluminum Nitrde Metallized Ceramic Substrate

Features of Ceramic Substrate：

1.Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation

Advantages of DBC ceramic substrate:
>high mechanical strength
>fine thermal conducticity
>excellent electrical isolation
>good adhesion
>corrosion resistant
>high reliability
>environmentally clean

Applications of DBC ceramic substrate:
1.power semiconductor modules
2.semiconductor refrig-erators
3.power control circuits
4.high frequency switch mode power suppliers
5.solid-state relays

体积密度

Density

g/cm³

≥3.30g/cm³

水率 %

Water absorption

%

0

热导率

Thermal conductivity

(20 ℃,W/m·K)

≥170

线膨胀系数

Linear expansion coefficient

(RT-400℃,10^-6)

4.4

抗弯强度

Flexural strength

MPa

≥330

体积电阻率

Bulk resistance

Ω·cm

≥10¹⁴

介电常数

Dielectric constant

1 MHz

9.0

介质损耗

Dissipation factor

1 MHz

3 x 10^-4

抗电强度

Dielectric strength

KV/mm

≥15

表面粗糙度

Surface roughness

Ra(μm)

0.3~0.5

翘曲度

Camber

(~25.4(length))

0.03~0.05

外观

Appearance

致密 细晶 Dense