Copper Au Coating Metallized Ceramic DBC DPC Substrate

Features of Aln Ceramic Substrate:

1. High density assembly

Application of 96% Alumina Ceramic Substrate:
In the field of LED, high power semiconductor modules, semiconductor refrigerators, electronic heaters, power control circuits, power hybrid circuits, intelligent power components, high frequency switching power supplies.

Technology of coating Metallized Ceramic Substrate:

Our company is specialized in high-power ceramic heat dissipation substrates such as aluminum nitride and aluminum oxide,with thermal conductivity of 20-240w /M.K. Coating types: gold, platinum, silver etc.

体积密度

Density

g/cm³

≥3.30

吸水率 %

Water absorption

%

0

热导率

Thermal conductivity

(20 ℃,W/m·K)

≥170

线膨胀系数

Linear expansion coefficient

(RT-400℃,10^-6/K)

4.4

抗弯强度

Flexural strength

MPa

≥330

体积电阻率

Bulk resistance

Ω·cm

≥10¹⁴

介电常数

Dielectric constant

1 MHz

9.0

介质损耗

Dissipation factor

1 MHz

3 x 10^-4

抗电强度

Dielectric strength

kV/mm

≥15

表面粗糙度

Surface roughness

Ra(μm)

0.3~0.5

翘曲度

Camber

(~25.4(length))

0.03~0.05

外观

Appearance

致密 细晶 Dense

注：1.表面光洁度经抛光处理后，Ra≥0.1μm

Surface roughness can be reached 0.1μm after polished.

2.产品各向尺寸精度通过激光划线保证，最小值±0.10mm

Size tolerance can be controlled in +-0.10mm with laser machined

3.特殊规格产品可按照客户要求定制生产

Special specifications can be supplied upon requests.